Advances in sensing, manufacturing, computational resources, and data-driven methods are enabling new approaches to electromagnetic sensing, non-destructive evaluation, and advanced materials processing. This webinar will demonstrate how the COMSOL Multiphysics software supports predictive modeling by coupling electromagnetic fields with thermal, chemical, mechanical, and transport phenomena across multiple length and time scales.
The first application we will show focuses on eddy-current thermometry for reconstructing three-dimensional temperature fields in metal plates. Temperature-dependent electrical conductivity alters induced currents and magnetic fields, enabling volumetric thermal inference. COMSOL simulations of defects and laser-induced transient heating will support validation of reconstruction algorithms. Multifrequency excitation will be investigated to improve depth discrimination through frequency-dependent penetration depths and sensitivities.
The second application examines microwave-enabled volumetric additive manufacturing of ceramic components. A high-power microwave beamforming array delivers localized energy into three-dimensional volumes, enabling processing of opaque, particle-laden resins. Coupled COMSOL models of electromagnetic propagation, microwave absorption, heat transfer, and ceramic sintering kinetics are used to predict temperature evolution, reaction progression, spatial resolution, and processing scalability. Future extensions will incorporate pulsed excitation, fluid flow, resin viscosity, convection, shrinkage, and solid mechanics.
Together, these examples demonstrate how the COMSOL software can integrate multiphysics modeling with sensing, manufacturing, and data inversion. This webinar will present two applications of coupled electromagnetic and thermal modeling in COMSOL Multiphysics: eddy-current thermometry in metal plates and microwave-assisted processing of ceramic-loaded resins. By connecting simulation with practical engineering systems, COMSOL-based modeling can accelerate technology development, reduce experimental iteration, and support reliable scale-up of next-generation electromagnetic technologies.
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